TECAPOWDER PI solution grades for coatings

TECAPOWDER PI solution grade granulate is used to make special coatings and adhesives. Films, coatings or stand-alone substrates made from PI Powder are very useful in applications that require elevated temperatures along with excellent chemical resistance. PI Powder, based on P84® by Evonik, is a fully imidised polyimide in solution form. It does not require a long post cure step – simply the removal of the solvent.

many advantages for coatings

TECAPOWDER PI solution grade granulate has important uses in the industry due to the unique combination of high temperature stability and chemical resistance. 

Specialty coatings made of TECAPOWDER PI granulate allow customers to formulate different weight percent solids content and allow for various additives to improve end use characteristics. The fully imidised solutions can be used as structural adhesives and bond very well to most metals.

Outstanding properties

Chemical properties

Solution grade granulate

Solid TECAPOWDER PI polyimide for dissolving in NMP, DMSO, Dmac. Solutions in NMP are achievable from 5-35 % solid content in NMP.

  • Fully imidised
  • Excellent chemical resistance to acids reaching to the neutral side of the pH scale
  • Excellent resistance to organic solvents, oils and fuels e.g.: nitric acid, hydrochloric acid, acetic acid, formic acid, oxalic acid, ethylene glycol, acetone, benzene, diglycolic methyl ether, methylene glycol, perchloro ethylene, tetra chloro ethane, toluene and trichloroethylene
  • Contact with alkaline media should be avoided
  • Solubility in high polar solvents such as dimenthylformamide (DMF), N-Methylpyrrolidone (NMP)

Viscosity

Viscosity versus solid content in NMP

(Typical Solution Grade Granulate)

Thermal properties

TECAPOWDER PI is an organic polymer with exceptional heat resistance.

 

Glass transition temperature (Tg)
  315 °C (599 °F)
Decomposition temperature (onset)
  > 550 °C (> 1,000 °F)
10 % loss of weight  in air: 525 °C (977 °F)

 in nitrogen: 570 °C (1,000 °F)
No melting point  
Limiting Oxygen Index (LOI)  38 % O2

Thermogravimetric analysis

More on TECAPOWDER PI properties

Processing Guidelines

  • Put desired quantity of granulate into clean and dry flask or container. Add accurate volume of NMP. Close the container tightly and shake immediately and continuously to avoid agglomeration. Put immediately on a roll jack and dissolve at low speed for 72 hours at room temperature.

    • Recommended solvent: N-Meth pyrrolidone (NMP)
    • Limit of possible solid content: approximately 30 %
    • Important note: Do not use high speed mixers for acceleration of dissolving process. Also do not heat solution.
    • Application by casting, dipping, spin-coating, spraying (only low viscosity) or roller coating
    • Non-compatibility with non-solvents (precipitation of polymer). Since the solvents used are hygroscopic, coagulation can also be triggered off by moisture.
    • Solubility in high polar solvents such as dimethylformamide (DMF), N-methyl pyrrolidone (NMP), etc.
    • Do not use mixers with high shear rate to incorporate additives like fillers
    • Thermal drying without chemical reaction
    • Contact with alkaline media should be avoided

    Drying cycle for DMF-solution, coating 0,025 mm (2 Mil), dry

    Softening temperature
    (depending on residual solvent)

Product datasheets, safety documents and certificates

For further information please contact [obfemailstart]dGVjYXBvd2RlckBlbnNpbmdlcnBsYXN0aWNzLmNvbQ==[obfemailend].