TECAPOWDER PI solution grade granulate is used to make special coatings and adhesives. Films, coatings or stand-alone substrates made from PI Powder are very useful in applications that require elevated temperatures along with excellent chemical resistance. PI Powder, based on P84® by Evonik, is a fully imidised polyimide in solution form. It does not require a long post cure step – simply the removal of the solvent.
TECAPOWDER PI solution grade granulate has important uses in the industry due to the unique combination of high temperature stability and chemical resistance.
Specialty coatings made of TECAPOWDER PI granulate allow customers to formulate different weight percent solids content and allow for various additives to improve end use characteristics. The fully imidised solutions can be used as structural adhesives and bond very well to most metals.
Solid TECAPOWDER PI polyimide for dissolving in NMP, DMSO, Dmac. Solutions in NMP are achievable from 5-35 % solid content in NMP.
(Typical Solution Grade Granulate)
TECAPOWDER PI is an organic polymer with exceptional heat resistance.
Glass transition temperature (Tg) |
315 °C (599 °F) |
Decomposition temperature (onset) |
> 550 °C (> 1,000 °F) |
10 % loss of weight | in air: 525 °C (977 °F) |
in nitrogen: 570 °C (1,000 °F) |
|
No melting point | |
Limiting Oxygen Index (LOI) | 38 % O2 |
Put desired quantity of granulate into clean and dry flask or container. Add accurate volume of NMP. Close the container tightly and shake immediately and continuously to avoid agglomeration. Put immediately on a roll jack and dissolve at low speed for 72 hours at room temperature.
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