The electronics industry has developed more rapidly in recent years than almost any other industry. The megatrend of digitalization has made electronic components an indispensable part of our everyday lives. In industry, for use in sensors or antennas, and in private households, for use in smartphones for example, digital electronics have become indispensable and permanently in use. The resulting new requirements create challenges for many manufacturers. The increasing amount of data requires ever increasing performance criteria for the components, and at the same time, the products often have to become smaller and more compact. In addition, the product life cycle of electronic components has become significantly shorter in recent years, which in turn requires materials and manufacturing processes that are as cost-effective as possible.
Plastics offer ideal solutions for this. With their diverse properties, individual and detailed components can be manufactured. Among other things, they have excellent insulating properties, high temperature resistance and are also extremely durable. Thanks to the numerous modification possibilities through various reinforcements and fillers, they also offer a high degree of flexibility.
In addition to our compounds specially produced for components in the electronics industry, we offer a comprehensive portfolio of semi-finished products and finished parts. Our solution expertise covers the entire spectrum of the industry, from simple cables to highly complex sensor solutions and entire microsystems, which we manufacture completely inhouse using an innovative new development process.
To meet the high demands of the electronics industry, we manufacture compounds, stock shapes and finished parts to the highest quality standards. Among other things, most of Ensinger's data sheets provide information on the material's UL94 rating.
In addition, we have compounds specified by LPKF for laser direct structuring in our portfolio.
The use of materials with special LDS additives allows the application of small, conductive structures to be injection molded into three-dimensional micro components. As suitable materials for this area, our high-temperature resistant compounds solve demanding challenges. We would be happy to help you with the implementation of your project and also support you beyond pure materials expertise.