PI polyimide powder

TECAPOWDER PI  - polyimide powder from Ensinger

TECAPOWDER PI polyimides, the top end of high performance plastics, are useful in various demanding applications in industries such as aerospace, semiconductor, automotive, aircraft, plasma-welding and diamond wheel. No other plastic material keeps more superlatives in its designation than polyimides. TECAPOWDER PI is based on P84® by Evonik. BTDA and PMDA monomers reacted with isocyanate to produce fully imidised polyimide resins without the need for post curing.

Since 1984 the production and the development of TECAPOWDER has been situated in Austria, Lenzing. The Ensinger group is engaged in the development, manufacture and sale components made of engineering and high performance plastics. Further development of proven production techniques, new applications and international expansion have earned the enterprise a place among the leaders in its field.

Product types - modifications of Polyimide powder

TECAPOWDER PI are produced in different particle size distributions (mesh), fillers and qualities, depending on the intended end use and processing method.

TECAPOWDER PI STD yellow (standard)

  • 40 mesh
  • 200 mesh
  • 325 mesh
  • 425 mesh
  • 1200 mesh

TECAPOWDER PI STD (standard) grades are used for polymer alloys, plasma spray coatings, direct forming and composites. STD grades have no heat history and are fully reactive and sinterable.

TECAPOWDER PI SG yellow (solution grade)

TECAPOWDER PI SG yellow

  • Granulates  
  • 200 mesh

TECAPOWDER PI SG HT yellow

  • Granulates  

TECAPOWDER PI solution grade materials are used in wire coatings and adhesives. SG grades are for solution blending in dissolving in DMF, DMSO or other polar solvents.

TECAPOWDER PI VPD and HT VPD yellow

(vacuum predried and vaccum predried - high temperature)

TECAPOWDER PI VPD yellow

  • 1200 mesh

TECAPOWDER PI HT VPD yellow

  • 325 mesh
  • 325 / 1200 mesh
  • 425 mesh
  • 1200 mesh

TECAPOWDER PI HT VPD grades are highly crosslinked which allows their use as a filler in many fluoropolymers. Small mesh sizes enable good properties and uniform colour in sintered PTFE compounds.

TECAPOWDER PI HCM yellow(hot compression molding)

  • 40 mesh
  • 200 mesh
  • 325 mesh
  • 425 mesh
  • 1200 mesh

TECAPOWDER PI HCM grades are used to mold high performance stock shapes (hot compression molding). Virgin grades use 40 mesh and our blended grade is 325 mesh. Heat history with HCM grades allow for compression molding without outgassing.

TECAPOWDER PI HCM blends

  • TECAPOWDER PI HCM GR15 black
  • TECAPOWDER PI HCM GR40 black
  • TECAPOWDER PI HCM TF30 yellow
  • TECAPOWDER PI HCM CF10 TF5 GR5 black
  • TECAPOWDER PI HCM GF30 yellow
  • TECAPOWDER PI HCM CF20 black
  • TECAPOWDER PI HCM CF30 black

TECAPOWDER PI HCM blends contain various fillers for high-performance semi-finished products based on the end use requirements. Graphite grades are for excellent bearing and wear resistance parts.

TECAPOWDER PI HCM HT yellow and blends

(hot compression molding - high temperature)

TECAPOWDER PI HCM HT yellow

  • 40 mesh
  • 325 mesh
  • 1200 mesh

TECAPOWDER PI HCM HT blends

  • TECAPOWDER PI HCM HT GR15 black
  • TECAPOWDER PI HCM HT GR40 black
  • TECAPOWDER PI HCM HT TF30 yellow
  • TECAPOWDER PI HCM HT CF20 yellow

TECAPOWDER PI HCM HT yellow and blends are used for high performance stock shapes using our HT polymer. Heat history on the powder enables compression molding without outgassing and cracks in final stock shapes.

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Delivery forms

TECAPOWDER PI HCM grades are used to mold high performance stock shapes. TECAPOWDER PI STD can be used in composites.

TECAPOWDER PI solution grade materials are for dissolving in DMF, DMSO or other polar solvents for use in speciality coatings.

TECAPOWDER PI HT VPD  grades are highly crosslinked which allows its use as a filler in many fluorpolymers. Small mesh sizes allow for good properties and uniform colour in sintered PTFE compounds. 
TECAPOWDER PI HCM blends contain various fillers for high-performance semi-finished parts based on the end use requirements. Graphite grades are excellent for bearing and wear resistance parts. Glass fibre grades are used for high strength and dimensional stability.

PI Powder properties

  • TECAPOWDER PI has an excellent long term thermal stability. It keeps its dimensional stability and flexural strength at elevated temperatures due to the high glass transition temperature. Creep under load at high temperatures is also excellent. 

    Glass transition temperature of PI in comparison to high-temperature thermoplastics

    Retention of flexural strength under exposure to elevated temperatures

    Coefficiant of linear thermal extension

    Dynamic mechanical analysis of TECAPOWDER PI

    Retention of tensile strength under exposure to elevated temperatures

  • Parts made of TECAPOWDER PI are often used as bushings or washers due to their outstanding tribological properties and high wear and creep resistance at elevated temperatures. Typical fillers such as graphite powder provide P84 with very low wear rates which is useful in bushing and bearing applications.

    K factors at elevated temperatures

    Abrasion of sliding counterpart over 16 hours against steel 100 Cr6 (bearing grade) in µm

    Creep under load

    Linear wear at 150 °C/300 °F

  • Virgin resin

    Base resin: TECAPOWDER PI HCM yellow, 40 mesh

    • Best mechanical and electrical properties
    • Good friction and wear behavior, high radiation stability

    Graphite composite

    Base resin: TECAPOWDER PI HCM yellow, 325 mesh, filler 15 % graphite

    • Excellent friction and wear properties
    • High residual mechanical strength
    • Very smooth machined surfaces

    Graphite/PTFE composite

    Base resin: TECAPOWDER PI HCM yellow, 325 mesh, filler 15 % graphite and 5 % PTFE

    • Lower coefficient of friction compared to formulations without PTFE
    • Outstanding friction properties on rough sliding surfaces through PTFE transfer to the opposite material

    PTFE composite

    Base resin: TECAPOWDER PI HCM yellow, 325 mesh, blended with 30 % PTFE

    • Lowest coefficient of friction of all PI composites

    MoS2 composite

    Base resin: TECAPOWDER PI HCM yellow, 325 mesh, blended with 15 % MoS2

    • For tribological applications in dry ambiance and vacuum

    Carbon fiber

    • Due to the negative thermal expansion of carbon fibers, the coefficient of linear thermal expansion of P84 can effectively be to the same level as metals. As well as the thermal transmission of such composites which is much better than under the use of graphite. Therefore, it is well known that blending only 0,5 % of carbon fibers (CF) in 3 mm length will double the heat transmission of plastics. The use of up to 30 % CF increases the flexural modulus significantly.
    • A disadvantage is the poor machinability of such materials as well as the reduction of elongation. It is not possible to improve tensile strength of TECAPOWDER PI using reinforcement fibers.

    Glass fibers/balls

    • The use of up to 50 % by weight of glass is used to improve the heat deflection temperature (HDT) of TECAPOWDER PI in very temperature sensitive applications (for example welding apparatus or plasma guns; arc resistance required).
    • The addition of 5 % PTFE to this composite improves machinability

TECAPOWDER PI for special applications

TECAPOWDER PI powder in high performance parts

  • Excellent dimensional stability
  • Good creep resistance under high load at elevated temperatures which are unreachable for other plastics.
  • Even under short term heating up to 350 °C (660 °F) parts made of TECAPOWDER PI do not melt or soften
Details

TECAPOWDER PI powder as filler for PTFE reinforcement

  • Excellent wear behavior without abrasion of the sliding partner
  • High creep resistance under load and a real bonding of the powder into the matrix
  • Excellent surfaces of skived films of these compounds
    Details

    TECAPOWDER PI powder for resin in diamond wheels

    • High level bearing capacity
    • Thermal stability
    • High grinding speeds
    • Double the performance versus phenolic
    Details

    TECAPOWDER PI powder improves the performance of lithium batteries

    • High thermal resistance
    • Good wear resistance at elevated temperatures
    • Very good creep resistance
    • High compressive strength
    • Very high glass transition temperature
    • Excellent mechanical properties
    • High purity
    • Good plasma erosion
    • Low outgassing
    Details

    TECAPOWDER PI solution grades for coatings

    • Improved chemical resistance
    • High temperature stability
    • Bonds very well to most metals
      Details

      TECAPOWDER PI for parts in semiconductor production

      • High purity
      • Plasma resistant
      • Dimensionally stable at high temperatures
      • Very good machinability
          Details

          TECAPOWDER PI for composite materials

          • Higher impact strength
          • Better interlaminar shear strength
          • Reduced micro cracking compared to virgin polymer systems
          Details

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          Certificates: ISO 9001
          For further information, please contact: [obfemailstart]dGVjYXBvd2RlckBlbnNpbmdlcnBsYXN0aWNzLmNvbQ==[obfemailend]