TECAWAFER PEEK LDS grey 1066651

Rethink wafers with TECAWAFER

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TECAWAFER PEEK LDS grey sets new standards in microsystems technology, offering the same advantageous properties as TECAWAFER PEEK LDS black. The grey variant expands our portfolio and opens up additional design possibilities for demanding applications. The formulation of the raw material is also biocompatible, making it easier to access end applications in the medical market.

Our expert team is always available for comprehensive consultations and to help you select the optimal substrate for your specific requirements.

Facts

Chemical designation
PEEK (Polyetheretherketone)
Colour
black
Density
1.65 g/cm3

Main Features

  • lithography capable
  • PVD / CVD capable
  • wirebonding possibile
  • electroplating possible
  • developed for the LPKF-LDS® process
  • reflow soldering possible
  • inherent flame retardant
  • low moisture absorption

Target industries

MEMS technology
sensor technology
semiconductor technology
electronics
interposer technology
cleanroom technology

Downloads

Datasheet (PDF)

Technical details

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  • product-technical-detail-collapse-item-0-lvl-1
    General material information Value Unit Parameter Norm
    thickness 1100 +-25 micro -
  • product-technical-detail-collapse-item-1-lvl-1
    Mechanical properties Value Unit Parameter Norm
    Tensile strength 103 MPa DIN EN ISO 527-1
    Elongation at break (tensile test) 2,2 % DIN EN ISO 527-1
    Impact strength (Charpy) 30 kJ/m2 DIN EN ISO 179-1eU
  • product-technical-detail-collapse-item-2-lvl-1
    Thermal properties Value Unit Parameter Norm
    Glass transition temperature 143 C -
    Melting temperature 343 C -
    Service temperature 300 C short term -
    Service temperature 260 C long term -
    Thermal expansion (CLTE) 31 106*K-1 in plane DIN EN ISO 11359-1;2
    Thermal expansion (CLTE) 18 106*K-1 perpendicular to the plane DIN EN ISO 11359-1;2
    Thermal expansion (CLTE) 87 106*K-1 in plane DIN EN ISO 11359-1;2
    Thermal expansion (CLTE) 47 106*K-1 perpendicular to the plane DIN EN ISO 11359-1;2
    Specific heat 0,8 J/(g*K) DIN EN 821
    Thermal conductivity 1,2 W/(k*m) in plane ISO 22007-4:2008
    Thermal conductivity 0,5 W/(k*m) perpendicular to the plane ISO 22007-4:2008
  • product-technical-detail-collapse-item-3-lvl-1
    Electrical properties Value Unit Parameter Norm
    surface resistivity 1 * 1014 Ω DIN EN 61340-2-3
    Dielectric strength 17,5 kV/mm 70 mm x 70 mm x 3 mm ISO 60243-1
    Dielectric loss factor 0,0006 test frequency of 1 GHz -
    Dielectric constant 3,6 test frequency of 1 GHz -
    Resistance to tracking (CTI) 225 V DIN EN 60112
  • product-technical-detail-collapse-item-4-lvl-1
    Other properties Value Unit Parameter Norm
    Water absorption 0,04 % 23 °C / 50 % relative humidity up to saturation DIN EN ISO 62
    Flammability (UL94) V0 at 0,9 mm DIN IEC 60695-11-10;
    Adhesive strength (metal path) 19,4 N/mm2 -