Substrates for microelectromechanical systems (MEMS) are usually made of silicon, ceramic or glass. However, with the Ensinger Microsystems Technology (EMST), the tiny helpers can be produced much easier. Lithography in the cleanroom becomes obsolete. Instead, extremely fine structures are implemented during injection molding of the polymer wafer and metallically functionalized. This allows for meeting individual requirements - also in terms of system integration.
Technical article by Matthias Wuchter (Ensinger GmbH)
Companies can use molded interconnect devices (MIDs) to develop components that are smaller and less expensive than would be possible with conventional printed circuit boards. For laser direct structuring of the three-dimensional micro-components Ensinger develops heat-conducting compounds based on high-performance polymers.
Technical article by Fran Alder (Medical industry specialist, Ensinger Inc.)
Application development for medical devices requires knowledge of material properties to support function, chemical compatibility with sanitizing cleaners and sterilization methods, as well as issues of biocompatibility based on intended use. Material suppliers are challenged to not only address the tried-and-true basics regarding the limitations of materials to support mechanical function, but also whether a material is safe to use in contact with the body, or for use in a general medical environment. There are some unique considerations to think about be fore recommending a material for a medical device that includes the working environment the device will be used in.
With high-rise buildings in particular, architects and planners are keen on using aluminium windows. Aluminium profiles have very high execution accuracy, they enable customised design possibilities and are extremely lightweight. In addition, aluminium has high chemical resistance and is mechanically resilient. The disadvantage, however, is that it is very good at conducting heat. Insulating profiles made from engineering plastics provide thermal separation that ensures energy-efficient windows, doors and façades.
Technical article by Christopherus Bader / Erwin König (Priamus System Technologies GmbH) and Christoph Schmidt (Ensinger GmbH)
Injcetion moulding process Control with cavity pressure and temperature sensors. To preproduce an injcetion moulded part in the same quality, it is not enough to use the machine settings as basis, since even an optmized process changes continually. However, different part properties can be controlled as desired directly from the cavity. This means that processors no longer need to elaborately text these features after the injection moulding process.
Technical article by Matthias Wuchter (Ensinger GmbH) and Marcel Döring (3M Deutschland GmbH)
High-performace Compounds. Low-density injection moldable thermoplastics can save resources and costs in ligthweight construction applications. By incorporating hollow glass beads in matrix polymers such as PEEK and polyamide 6, it has been possible to produce technically sophisticated compounds. These can be used, for example, in aviation, automotive engineering, and medical technology.