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Technical Articles

Find articles on Ensinger products, technical solutions and customized applications.

Window and Façade Magazine 07/2019: Two Effective Measures to Increase the Energy Efficiency of a Building

With high-rise buildings in particular, architects and planners are keen on using aluminium windows. Aluminium profiles have very high execution accuracy, they enable customised design possibilities and are extremely lightweight. In addition, aluminium has high chemical resistance and is mechanically resilient. The disadvantage, however, is that it is very good at conducting heat. Insulating profiles made from engineering plastics provide thermal separation that ensures energy-efficient windows, doors and façades.

Kunststoffe International 6/2013: Quality from the Depth of the Mould

Technical article by Christopherus Bader / Erwin König (Priamus System Technologies GmbH) and Christoph Schmidt (Ensinger GmbH)

Injcetion moulding process Control with cavity pressure and temperature sensors. To preproduce an injcetion moulded part in the same quality, it is not enough to use the machine settings as basis, since even an optmized process changes continually. However, different part properties can be controlled as desired directly from the cavity. This means that processors no longer need to elaborately text these features after the injection moulding process.

Kunststoffe international 9/2011: Light in weight, High in performance

Technical article by Matthias Wuchter (Ensinger GmbH) and Marcel Döring (3M Deutschland GmbH)

High-performace Compounds. Low-density injection moldable thermoplastics can save resources and costs in ligthweight construction applications. By incorporating hollow glass beads in matrix polymers such as PEEK and polyamide 6, it has been possible to produce technically sophisticated compounds. These can be used, for example, in aviation, automotive engineering, and medical technology.

Kunststoffe interational 6/2015: Compounds for 3-D Micro-Components

Technical article by Matthias Wuchter (Ensinger GmbH)

Companies can use molded interconnect devices (MIDs) to develop components that are smaller and less expensive than would be possible with conventional printed circuit boards. For laser direct structuring of the three-dimensional micro-components Ensinger develops heat-conducting compounds based on high-performance polymers.

IAPD Magazine Dec. 2011 / January 2012: Application development in the medical industry

Technical article by Fran Alder (Medical industry specialist, Ensinger Inc.)

Application development for medical devices requires knowledge of material properties to support function, chemical compatibility with sanitizing cleaners and sterilization methods, as well as issues of biocompatibility based on intended use. Material suppliers are challenged to not only address the tried-and-true basics regarding the limitations of materials to support mechanical function, but also whether a material is safe to use in contact with the body, or for use in a general medical environment. There are some unique considerations to think about be fore recommending a material for a medical device that includes the working environment the device will be used in.