Rethink microsystems technology and sensor applications with Ensinger Microsystems Technology (EMST). Learn more about our innovative technology and substrate materials like TECAWAFER and TECASUB in action.
EMST is redefining the way temperature sensors are made. Moving away from traditional materials, we are using TECACOMP PEEK LDS to unlock opportunities beyond conventional sensor manufacturing. With its lower thermal conductivity and versatile functionalisation capabilities, EMST offers solutions that are functional, integrable and customisable. Our substrate options meet a wide range of sensor requirements.
EMST introduces a new approach to pressure sensor manufacturing. By using PEEK-based wafers, we simplify production processes and eliminate complex procedures and harsh chemicals. Our innovative processes deliver pressure sensors with increased functionality and customisation. EMST specialises in fully integrated differential pressure sensors and offers unrivalled flexibility for customer-specific solutions.
EMST is at the forefront of transforming flow sensor manufacturing with our newly invented technology tailored for PEEK-based substrates. Our collaboration with Hahn Schickard has resulted in a thermal flow sensor that exploits the unique properties of our materials. This innovation opens the door to functional, integratable and fully customisable solutions, paving the way for new possibilities in sensor technology.
