Molded Interconnect Devices (MID) integrate conductors and electrical circuits directly into three-dimensional plastic components. A laser-direct structurable, highly filled material is used for this purpose. Ensinger has developed the TECACOMP PEEK LDS formulation for demanding conditions. The material has been approved by LPKF Laser & Electronics AG.
Detectable fillers are added to high performance plastics for use in the food or pharmaceutical industry. Even small foreign bodies in the material can be detected in the production process with metal or X-ray detectors. TECACOMP PEEK ID blue also contains blue colour pigments that are visible with optical inspection equipment. All additives are suitable for food contact.