TECASUB PEEK LDS black
The only LDS-capable film substrate on the market
TECASUB PEEK LDS is the first film substrate on the market specifically designed for Laser Direct Structuring (LDS). This innovative film substrate sets new standards in microsystems technology, offering a precise and flexible solution for complex structures. TECASUB opens up new possibilities for the production of substrates for demanding industrial applications.
Unique LDS Capability: As the only LDS-capable film substrate, TECASUB enables the creation of complex structures with high precision and offers additional flexibility and design freedom through direct VIAs (Vertical Interconnect Access) on the film substrate.
TECASUB provides similar chemical and thermal properties to polyimide film substrates but at a more competitive price. It is characterised by excellent surface quality and thermal properties.
Roll-to-roll production: By eliminating the need for additional insulation layers and loops, TECASUB reduces production costs and allows for a more resource-efficient structuring compared to copper film substrates. Innovative manufacturing processes such as PVD coating contribute to lowering initial costs. The roll-to-roll production of TECASUB enables efficient and cost-effective manufacturing of flexible substrates at high speed and lower costs compared to batch processes for film substrates and wafers.
TECASUB reduces effort and environmental impact compared to polyimide film substrates, which require complex copper lamination and etching. The resource-efficient structuring and recyclability of the film substrate make it more environmentally friendly. TECASUB is ideally suited for multilayer systems, interposers with deep structures, antennas made from deep-drawable materials, and layers on other substrates.
Our experts are happy to advise you and help you find the ideal substrate for your specific requirements.
Unique LDS Capability: As the only LDS-capable film substrate, TECASUB enables the creation of complex structures with high precision and offers additional flexibility and design freedom through direct VIAs (Vertical Interconnect Access) on the film substrate.
TECASUB provides similar chemical and thermal properties to polyimide film substrates but at a more competitive price. It is characterised by excellent surface quality and thermal properties.
Roll-to-roll production: By eliminating the need for additional insulation layers and loops, TECASUB reduces production costs and allows for a more resource-efficient structuring compared to copper film substrates. Innovative manufacturing processes such as PVD coating contribute to lowering initial costs. The roll-to-roll production of TECASUB enables efficient and cost-effective manufacturing of flexible substrates at high speed and lower costs compared to batch processes for film substrates and wafers.
TECASUB reduces effort and environmental impact compared to polyimide film substrates, which require complex copper lamination and etching. The resource-efficient structuring and recyclability of the film substrate make it more environmentally friendly. TECASUB is ideally suited for multilayer systems, interposers with deep structures, antennas made from deep-drawable materials, and layers on other substrates.
Our experts are happy to advise you and help you find the ideal substrate for your specific requirements.