TECAFIL PEEK LDS black - 1.75 mm
PEEK LDS (Laser Direct Structuring) Filament
As a specialist for highly modified materials and solutions in various industries, we offer a new solution for 3D printing with PEEK for the electronics industry.
As the world's only certified supplier of a PEEK LDS at LPKF Laser & Electronics AG, we offer a PEEK filament that can be modified by laser direct structuring (LDS). Together with our own compounding department and its extensive experience with materials for laser direct structuring, we were the first company in the world to develop a PEEK filament with LDS feature.
With the MID (Molded Interconnect Devices) process and the conductive tracks generated on the application, both functional and solid components such as smartphone housings with integrated antennas can be combined.
The metallization properties of our TECAFIL PEEK LDS black are comparable to those of injection molded PEEK LDS compound, despite a rougher surface due to additive manufacturing.
This has been confirmed to us by the Hahn Schickard Institute of Engineering.
Why use PEEK 3D printing filament with LDS feature?
PEEK filament prices are relatively high compared to standard or engineering plastics. But with the ideal properties of PEEK filament in terms of high thermal stability, good adhesion, high weld line strength and good chemical resistance, printing PEEK offers enormous advantages and, unlike other filaments, opens up a whole new range of applications.
The heat resistance of PEEK allows PEEK with LDS addition, reflow soldering and direct assembly of the application.
In addition, coating by hole bonding is also possible with this filament.
Thus, this PEEK filament offers enormous advantages for LDS components, as functional prototypes and small series can be produced with a 3D printer without the need to invest in an injection mold. PEEK LDS is generally known for applications such as sensors, antennas or safety components.