TECACOMP PEEK LDS grey 1061958
Laser direct structurable PEEK compound with light inherent colour
TECACOMP PEEK LDS grey is a compound based on the high-performance plastic PEEK, which has been modified with a TiO2-based LDS additive and mineral filler. The special Ensinger formulation enables LDS functionality with very fine track widths (fine pitch). The fillers increase both the coefficient of thermal expansion towards copper and the thermal conductivity.
This PEEK LDS compound is characterised by very high purity and performance. It is the high-performance compound for laser direct structuring with the lowest dielectric loss (0.0006 at 1 GHz), making it very suitable for components in high frequency technology. Another special feature of the LDS plastic is its light inherent colour, which is particularly required for LED lighting applications. The material can be coloured by means of colour batch in the injection moulding process, so customers can produce different coloured product variants. According to current knowledge, the biocompatibility of the high-performance plastic PEEK is not impaired by the modification, so it can also be used in medical technology. TECACOMP PEEK LDS grey is also used when greater stability in processing (problems with deposits in the mould) is desired.
Typical areas of application are in electrical engineering, mechanical engineering, medical technology or in the automotive and offshore industries. For example, the special plastics are used for components in antenna applications in the 5G sector, in heating or safety elements (cameras, rotor blades, lifts) or in microsystems technology (thermoplastic wafers, thin-film sensors or LDS transformers).
The base polymer PEEK is characterised by high thermal resistance up to 260 ℃ in continuous use and high mechanical strengths. Other special features include excellent chemical resistance, low outgassing, good radiation resistance and inherent flame resistance (UL94 V-0). Compared to TECACOMP LCP LDS, PEEK LDS has better weld line strength and is therefore suitable for components with critical holes or openings.
TECACOMP PEEK LDS grey is available as a compound. Tensile test bars and sample plates (80 x 80 x 3 mm) for laser and metallisation tests are available.
TECACOMP PEEK LDS is the only PEEK with LDS approved by LPKF Laser & Electronics AG. Ensinger is a member of 3D MID e.V. and supports customers in project planning via a very good network.