PEEK Compound TECACOMP PEEK LDS grey
PEEK Compound TECACOMP PEEK LDS grey

TECACOMP PEEK LDS grey 1061958

Laser direct structurable PEEK compound with light inherent colour

TECACOMP PEEK LDS grey is a compound based on the high-performance plastic PEEK, which has been modified with a TiO2-based LDS additive and mineral filler. The special Ensinger formulation enables LDS functionality with very fine track widths (fine pitch). The fillers increase both the coefficient of thermal expansion towards copper and the thermal conductivity.

This PEEK LDS compound is characterised by very high purity and performance. It is the high-performance compound for laser direct structuring with the lowest dielectric loss (0.0006 at 1 GHz), making it very suitable for components in high frequency technology. Another special feature of the LDS plastic is its light inherent colour, which is particularly required for LED lighting applications. The material can be coloured by means of colour batch in the injection moulding process, so customers can produce different coloured product variants. According to current knowledge, the biocompatibility of the high-performance plastic PEEK is not impaired by the modification, so it can also be used in medical technology. TECACOMP PEEK LDS grey is also used when greater stability in processing (problems with deposits in the mould) is desired.

Typical areas of application are in electrical engineering, mechanical engineering, medical technology or in the automotive and offshore industries. For example, the special plastics are used for components in antenna applications in the 5G sector, in heating or safety elements (cameras, rotor blades, lifts) or in microsystems technology (thermoplastic wafers, thin-film sensors or LDS transformers).

The base polymer PEEK is characterised by high thermal resistance up to 260 in continuous use and high mechanical strengths. Other special features include excellent chemical resistance, low outgassing, good radiation resistance and inherent flame resistance (UL94 V-0). Compared to TECACOMP LCP LDS, PEEK LDS has better weld line strength and is therefore suitable for components with critical holes or openings.

TECACOMP PEEK LDS grey is available as a compound. Tensile test bars and sample plates (80 x 80 x 3 mm) for laser and metallisation tests are available.

TECACOMP PEEK LDS is the only PEEK with LDS approved by LPKF Laser & Electronics AG. Ensinger is a member of 3D MID e.V. and supports customers in project planning via a very good network.

Facts

Chemical designation
PEEK (Polyetheretherketone)
Colour
grey
Density
1.65 g/cm3

Main Features

  • developed for the LPKF-LDS® process
  • high adhesive strength
  • very good chemical resistance
  • inherent flame retardant
  • good heat deflection temperature
  • low moisture absorption

Target industries

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Technical details


  • product-technical-detail-collapse-item-0-lvl-1
    Mechanical properties Value Unit Parameter Norm
    Tensile strength 103 MPa DIN EN ISO 527-1
    Modulus of elasticity
    (tensile test)
    10700 MPa DIN EN ISO 527-1
    Elongation at break (tensile test) 2,2 % DIN EN ISO 527-1
    Impact strength (Charpy) 30 kJ/m2 DIN EN ISO 179-1eU
  • product-technical-detail-collapse-item-1-lvl-1
    Thermal properties Value Unit Parameter Norm
    Glass transition temperature 143 C -
    Melting temperature 343 C -
    Heat distortion temperature 207 C ISO-R 75 Method A
    Service temperature 300 C short term -
    Service temperature 260 C long term -
    Thermal expansion (CLTE) 18 106*K-1 longitudinal DIN EN ISO 11359-1;2
    Thermal expansion (CLTE) 31 106*K-1 transverse DIN EN ISO 11359-1;2
    Thermal expansion (CLTE) 47 106*K-1 longitudinal DIN EN ISO 11359-1;2
    Thermal expansion (CLTE) 87 106*K-1 transverse DIN EN ISO 11359-1;2
    Thermal expansion (CLTE) 63 106*K-1 longitudinal DIN EN ISO 11359-1;2
    Thermal expansion (CLTE) 110 106*K-1 transverse DIN EN ISO 11359-1;2
    Thermal conductivity 1,2 W/(k*m) in-plane ISO 22007-4:2008
    Thermal conductivity 0,5 W/(k*m) through-plane ISO 22007-4:2008
  • product-technical-detail-collapse-item-2-lvl-1
    Electrical properties Value Unit Parameter Norm
    surface resistivity 1014 DIN EN 61340-2-3
    volume resistivity 1014 Ω*m DIN EN 61340-2-3
    Dielectric loss factor 0,0006 test frequency of 1 GHz -
    Dielectric constant 3,6 test frequency of 1 GHz -
  • product-technical-detail-collapse-item-3-lvl-1
    Other properties Value Unit Parameter Norm
    Molding shrinkage 0,6 % longitudinal DIN EN ISO 294-4
    Molding shrinkage 0,6 % transverse DIN EN ISO 294-4
    Water absorption 0,04 % 23 °C / 50 % relative humidity up to saturation DIN EN ISO 62
    Flammability (UL94) V0 at 0,9 mm DIN IEC 60695-11-10;
  • product-technical-detail-collapse-item-4-lvl-1
    Processing parameter Value Unit Parameter Norm
    processing temperatures 360 - 410 C -
    Mould temperature 170 - 210 C -
  • product-technical-detail-collapse-item-5-lvl-1
    Predrying Value Unit Parameter Norm
    Permissible residual moisture content 0,02 % -
    Drying temperature 160 C -
    Drying time 4 h -