TECACOMP PPA LDS black 1014979
Biobased PPA compound for laser direct structuring (LDS)
TECACOMP PPA LDS black was developed for the three-dimensional functionalisation of housings and surfaces with conductor track structures as well as for direct assembly with surface-mounted devices (SMD). The compound consists of a highly crystalline polyphthalamide (PPA) modified with additives based on copper-chromite-black spinel and mineral fillers.
The contained base polymer is 56 % bio-based, has a very high heat resistance, very low creep tendency and low moisture absorption. Special features of the special compound for laser direct structuring are a high thermal conductivity perpendicular to the injection moulding direction and a coefficient of thermal expansion similar to copper. The material can be reflow soldered and is characterised by good metallisability. Tensile test bars and sample plates (80 x 80 x 3 mm) for laser and metallisation tests are available.
Customers use the compound especially when high demands are made on the adhesive strength of the conductor track and a high weld line strength. The material absorbs less moisture than most other PPA compounds. Through-hole plating by laser drilling (via) is possible. TECACOMP PPA LDS black can be used permanently up to 150 °C, and up to 250 °C for short periods.
This PPA LDS compound is suitable, for example, for components in the automotive industry, electrical and lighting engineering or in mechanical engineering. Typical applications are sensors, AVT components, face recognition systems, safety elements or LED components. Ensinger is a member of the 3D MID research association and supports customers early in the project planning phase.