PPA-Compounds-TECACOMP-PPA-LDS-black
PPA-Compounds-TECACOMP-PPA-LDS-black

TECACOMP PPA LDS black 1014979

Biobased PPA compound for laser direct structuring (LDS)

TECACOMP PPA LDS black was developed for the three-dimensional functionalisation of housings and surfaces with conductor track structures as well as for direct assembly with surface-mounted devices (SMD). The compound consists of a highly crystalline polyphthalamide (PPA) modified with additives based on copper-chromite-black spinel and mineral fillers.

The contained base polymer is 56 % bio-based, has a very high heat resistance, very low creep tendency and low moisture absorption. Special features of the special compound for laser direct structuring are a high thermal conductivity perpendicular to the injection moulding direction and a coefficient of thermal expansion similar to copper. The material can be reflow soldered and is characterised by good metallisability. Tensile test bars and sample plates (80 x 80 x 3 mm) for laser and metallisation tests are available.

Customers use the compound especially when high demands are made on the adhesive strength of the conductor track and a high weld line strength. The material absorbs less moisture than most other PPA compounds. Through-hole plating by laser drilling (via) is possible. TECACOMP PPA LDS black can be used permanently up to 150 °C, and up to 250 °C for short periods.

This PPA LDS compound is suitable, for example, for components in the automotive industry, electrical and lighting engineering or in mechanical engineering. Typical applications are sensors, AVT components, face recognition systems, safety elements or LED components. Ensinger is a member of the 3D MID research association and supports customers early in the project planning phase.

Facts

Chemical designation
PPA (Polyphtalamide)
Colour
black
Density
1.96 g/cm3

Main Features

  • developed for the LPKF-LDS® process
  • high adhesive strength
  • good heat deflection temperature
  • partly biogenic (polymer consists of 56% renewable raw materials)

Target industries

Downloads

Technical details


  • product-technical-detail-collapse-item-0-lvl-1
    Mechanical properties Value Unit Parameter Norm
    Tensile strength 76 MPa DIN EN ISO 527-1
    Modulus of elasticity
    (tensile test)
    9200 MPa DIN EN ISO 527-1
    Elongation at break (tensile test) 1,2 % DIN EN ISO 527-1
    Impact strength (Charpy) 25 kJ/m2 DIN EN ISO 179-1eU
  • product-technical-detail-collapse-item-1-lvl-1
    Thermal properties Value Unit Parameter Norm
    Glass transition temperature 120 C -
    Melting temperature 315 C -
    Heat distortion temperature 237 C ISO-R 75 Method A
    Service temperature 250 C short term -
    Service temperature 150 C long term -
    Thermal expansion (CLTE) 43 106*K-1 longitudinal DIN EN ISO 11359-1;2
    Thermal expansion (CLTE) 47 106*K-1 transverse DIN EN ISO 11359-1;2
    Thermal expansion (CLTE) 62 106*K-1 longitudinal DIN EN ISO 11359-1;2
    Thermal expansion (CLTE) 71 106*K-1 transverse DIN EN ISO 11359-1;2
    Thermal expansion (CLTE) 97 106*K-1 longitudinal DIN EN ISO 11359-1;2
    Thermal expansion (CLTE) 112 106*K-1 transverse DIN EN ISO 11359-1;2
    Thermal conductivity 1,2 W/(k*m) in-plane ISO 22007-4:2008
    Thermal conductivity 0,9 W/(k*m) through-plane ISO 22007-4:2008
  • product-technical-detail-collapse-item-2-lvl-1
    Electrical properties Value Unit Parameter Norm
    surface resistivity 1015 DIN EN 61340-2-3
    volume resistivity 1015 Ω*m DIN EN 61340-2-3
    Dielectric loss factor 0,013 test frequency of 1 GHz -
    Dielectric constant 4,1 test frequency of 1 GHz -
    Resistance to tracking (CTI) 550 V DIN EN 60112
  • product-technical-detail-collapse-item-3-lvl-1
    Other properties Value Unit Parameter Norm
    Molding shrinkage 1,67 % longitudinal DIN EN ISO 294-4
    Molding shrinkage 1,45 % transverse DIN EN ISO 294-4
    Water absorption 0,35 % DIN EN ISO 1110
    Flammability (UL94) HB - 3,2 mm -
  • product-technical-detail-collapse-item-4-lvl-1
    Processing parameter Value Unit Parameter Norm
    processing temperatures 300 - 340 C -
    Mould temperature 90 - 160 C -
  • product-technical-detail-collapse-item-5-lvl-1
    Predrying Value Unit Parameter Norm
    Permissible residual moisture content 0,05 % -
    Drying temperature 120 C -
    Drying time 4 - 8 h -