TECAPEEK CMF white

Ceramic filled peek enhanced for micro machining

TECAPEEK CMF white is a composite material based on Victrex® PEEK 450G polymer which is filled with ceramic. This material has been specifically designed with the requirements of integrated circuit (IC) test sockets and electronic testing fixtures in mind. Because of intricate designs necessary for test sockets and fixtures, TECAPEEK CMF white has been designed with ceramic fillers to be very dimensionally stable and machinable with tightest tolerances. Ceramic filled PEEK resists the formation of burrs during machining and does not absorb moisture, allowing for accurate and precise geometries, without the necessity of secondary deburring operations. The right balance of stiffness and elongation allows machinability of micro holes smaller than 0.1 mm with high levels of hole position accuracy. Moreover, the elevated level of rigidity enables one to solve bending issues of contact plates with thin cross sections. The outstanding properties of PEEK natural such as excellent thermal resistance (up to 260 °C), low CLTE, low moisture absorption, and high strength are retained by TECAPEEK CMF white.

Compared to fibre-reinforced plastics, TECAPEEK CMF white provides less drill bit deflection, enabling significantly higher hole position accuracy. In addition, less drill bit wearing than fibre-reinforced plastics, enables longer drill bit lifetime, reducing machining costs.
Compared to injection molded plates, extruded TECAPEEK CMF white provides less residual stresses, enabling less warpage and bending during machining. Low internal stress and warpage is key for achieving the tight flatness tolerances, as the market is trending towards thinner cross sections of test socket contact plates. Moreover, lower internal stress enables faster speeds and feeds, resulting in faster part production and better yield, which reduces fabrication cost and time.
TECAPEEK CMF white is included in Ensinger's semiconductor grade portfolio, that is produced with stringent contamination controls and offering copy exact compliance. Therefore, Ensinger ensures the highest level of cleanliness and quality performance consistency of this unique property profile. The TECAPEEK CMF series is offered in white and grey  with the same property profile. With TECAPEEK SD black, Ensinger also offers an electrostatic dissipative version with comparable properties for enhanced micro machinability.

As with all Ensinger semiconductor grade materials, we can confirm that TECAPEEK CMF white meets the limitations imposed by RoHS Directive 2011/65/EU Restriction of Hazardous Substances in electrical equipment, and can also provide further conformity declarations on request.

Facts

Chemical designation
PEEK (Polyetheretherketone)
Color
white
Density
1.63 g/cm3

Main Features

  • high dimensional stability
  • good machinability
  • high strength
  • high stiffness
  • low thermal expansion
  • low burring
  • good heat deflection temperature
  • very good thermal stability

Target industries

Technical details


  • product-technical-detail-collapse-item-0-lvl-1
    Mechanical properties Value Unit Condition Test Method
    Tensile strength at yield 14,122 psi @ 73 °F ASTM D 638
    Elongation at break (tensile test) 4.85 % @ 73 °F ASTM D 638
    Modulus of elasticity
    (tensile test)
    1,227,111 psi @ 73 °F ASTM D 638
    Flexural strength 23,642 psi @ 73 °F ASTM D 790
    Modulus of elasticity
    (flexural test)
    783,585 psi @ 73 °F ASTM D 790
    Compression strength 1,855 psi @ 73 °F ASTM D 695
    Compression strength 20,712 psi @ 73 °F ASTM D 695
    Compression modulus 335,369 psi @ 73 °F ASTM D 695
    Impact strength (Izod) 0.66 ftlbsin @ 73 °F ASTM D 256
    Impact strength (Izod) 15.23 ftlbsin @ 73 °F ASTM D 256
    Rockwell hardness 102 - M-Scale ASTM D 785
    Tensile strength at break 15,200 psi 50 mm/min DIN EN ISO 527-2
    Elongation at yield (tensile test) 3 % 50 mm/min DIN EN ISO 527-1
  • product-technical-detail-collapse-item-1-lvl-1
    Thermal properties Value Unit Condition Test Method
    Melting temperature 643 F -
    Thermal conductivity 2.60 BTU-in/hr-ft^2 - deg ASTM E1530
    Service temperature 500 F Long Term -
    Service temperature 500 F short term -
    Thermal expansion (CLTE) 2.23 *10^-5 in/in / degre 73 F to 140 F ASTM E 831
    Thermal expansion (CLTE) 2.27 *10^-5 in/in / degre 73 F to 212 F ASTM E 831
    Thermal expansion (CLTE) 2.58 *10^-5 in/in / degre 212 F to 302 F ASTM E 831
  • product-technical-detail-collapse-item-2-lvl-1
    Electrical properties Value Unit Condition Test Method
    Dielectric strength 168 V/mil S/T, in oil ASTM D 149
    Dielectric constant 4.1 1 MHz dry ASTM D 150
    Dissipation factor 0.0032 - 1 MHz dry ASTM D 150
    volume resistance 3.5E+15 Ω*cm ASTM D 257
    surface resistivity 5.2E+15 Ω/square ASTM D 257
  • product-technical-detail-collapse-item-3-lvl-1
    Other properties Value Unit Condition Test Method
    Moisture absorption 0.03 % @ 24 hrs ASTM D 570
    Flammability (UL94) V0 - -

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