Electronic developers in microsystems technology face many challenges with traditional silicon, ceramic or glass wafers, leading to unnecessary complications, delays and production losses. With TECAWAFER, our polymer-based wafer, Ensinger Microsystems Technology (EMST) offers a revolutionary solution that is transforming technological progress.
With TECAWAFER, we are taking microsystems technology to a new level, offering tailor-made solutions that overcome the limitations of traditional wafer substrates. TECAWAFER offers unparalleled design freedom, enhanced packaging flexibility and simplifies the entire value chain, reducing dependence on lengthy global supply chains. The 4-inch wafer, based on TECACOMP PEEK LDS, offers outstanding chemical and temperature resistance - for solutions of the highest quality.
Traditional sensor manufacturing is a time-consuming and resource-intensive process that often limits customised solutions to high volume production. It also imposes significant design constraints on applications. TECAWAFER, our innovative PEEK-based wafer, provides a solution that overcomes these limitations and enables the creation of functionalised, integrated, and customised solutions.
With TECAWAFER, we offer a 4" wafer based on TECACOMP PEEK LDS as an alternative to silicon, ceramic, or glass wafers.
TECAWAFER is available in several variants, including biocompatible wafers. Learn more about the key benefits TECAWAFER offers compared to conventional wafer solutions.
TECAWAFER is revolutionising microsystems technology with a wide range of applications. Compatible with conventional lithography, PVD coatings and advanced structuring processes such as LDS, TECAWAFER facilitates the production of sensors, actuators and advanced microsystems, including GMR sensors with nanoscale layers. With TECAWAFER, we significantly shorten the value chain and ensure high delivery reliability with a standard portfolio available from stock. Made in Germany, TECAWAFER is a safe, sustainable and innovative solution for microsystems technology.
TECAWAFER has a particularly good surface roughness, achieved without any post-treatment. The standard surface roughness of TECAWAFER is at 20-30 nanometres Ra. For special applications, we can also realise roughnesses below 10 nanometres Ra. This allows us to achieve optimum surface qualities, suitable even for highly demanding applications such as those used in optics.
TECAWAFER can be further processed by standard lithography, PVD or PECVD processes and structured by LDS processes. PVD coatings, CVD coatings and various other processes such as ALD or PECVD can applied for thin film systems. A combination of conventional lithography, PVD coating and now LDS structuring, known from 3D-MID technology, offers completely new possibilities for the assembly and interconnection of thin film based microsystems.
By using the high performance polymer PEEK, TECAWAFER is chemically and temperature resistant, and electrically insulating. PEEK is also not thermally conductive to the same extent as silicon, glass or ceramics. As a result, TECAWAFER offers additional material-specific advantages compared to the conventional wafers available on the market.
Unlike conventional substrates, thermoplastic PEEK can be recycled. TECAWAFER is also much less energy intensive to produce than, for example, silicon, glass or ceramics. This also supports the sustainability goals of many applications and industries.
If you are interested in breaking new ground in the field of microsystems technology and in exploring the possibility of customising your substrate or the possibilities of innovative assembly and interconnection technology, please contact us. We are looking forward to creative applications for our TECAWAFER.