TECACOMP PEEK LDS black 1047045

Laser direct structurable PEEK compound

add to list
product enquiry
request sample

The compound TECACOMP PEEK LDS black is optimised with black copper-chromite-spinel additives and mineral filler and enables LDS functionality. In the laser direct structuring (LDS) process, injection-moulded surfaces or housings can be provided with conductor track structures and equipped with SMDs (surface-mounted devices). By modifying the high-performance plastic, the coefficient of thermal expansion in the direction of the copper is optimised and the thermal conductivity is increased. The special Ensinger filler concept enables very fine conductor spacing (fine pitch).

TECACOMP PEEK LDS is the only PEEK with LDS functionality approved by LPKF Laser & Electronics AG. Components made from the Ensinger compound can be laser direct structured, reflow soldered and have a high adhesive strength of the conductor path. Through-hole plating by means of laser drilling (VIA) is possible with a very small aspect ratio.

Thanks to their special properties, TECACOMP PEEK LDS compounds are used in electrical engineering, mechanical engineering, medical technology, the automotive sector and offshore applications.

Typical areas of application are components on heating elements (camera, radar, lidar or sensors), safety elements (screw locking devices on wind turbines, components on lifts or roller coasters) or in microsystems technology (thermoplastic wafers, thin-film sensor technology or LDS transformers). Laser direct structurable high-performance plastics are also increasingly used in antenna applications in the 5G sector. Especially for high-frequency applications with >20GHz or when isotropic properties are required. Compared to LCP LDS, TECACOM PEEK LDS has a significantly better weld line strength and is therefore used in particular for components with critical holes and breakthroughs.

The base polymer PEEK has one of the highest heat resistances (up to 260 ℃ continuous use) and mechanical strengths among plastics. It is characterised by high purity, excellent chemical resistance, inherent flame resistance (UL94 V-0), low outgassing and outstanding radiation resistance.

TECACOMP PEEK LDS black is available as compound or filament. Sample plates (80 x 80 x 3 mm) and tensile test bars are available for laser and metallisation tests.

Ensinger is a member of 3D MID e.V. and has a very good network to support customers in project planning.

Facts

Chemical designation
PEEK (Polyetheretherketone)
Colour
black
Density
1.67 g/cm3

Main Features

  • developed for the LPKF-LDS® process
  • high adhesive strength
  • very good chemical resistance
  • inherent flame retardant
  • good heat deflection temperature
  • low moisture absorption

Target industries

electrical engineering
mechanical engineering
medical technology

Downloads

Datasheet (PDF)

Technical details

  • product-technical-detail-collapse-item-0-lvl-1
    Mechanical properties Value Unit Parameter Norm
    Tensile strength 102 MPa DIN EN ISO 527-1
    Modulus of elasticity
    (tensile test)    		 10700 MPa DIN EN ISO 527-1
    Elongation at break (tensile test) 2,3 % DIN EN ISO 527-1
    Impact strength (Charpy) 31 kJ/m2 DIN EN ISO 179-1eU
  • product-technical-detail-collapse-item-1-lvl-1
    Thermal properties Value Unit Parameter Norm
    Glass transition temperature 143 C -
    Melting temperature 343 C -
    Heat distortion temperature 204 C ISO-R 75 Method A
    Service temperature 300 C short term -
    Service temperature 260 C long term -
    Thermal expansion (CLTE) 18 106*K-1 longitudinal DIN EN ISO 11359-1;2
    Thermal expansion (CLTE) 26 106*K-1 transverse DIN EN ISO 11359-1;2
    Thermal expansion (CLTE) 46 106*K-1 longitudinal DIN EN ISO 11359-1;2
    Thermal expansion (CLTE) 67 106*K-1 transverse DIN EN ISO 11359-1;2
    Thermal expansion (CLTE) 63 106*K-1 longitudinal DIN EN ISO 11359-1;2
    Thermal expansion (CLTE) 88 106*K-1 transverse DIN EN ISO 11359-1;2
    Thermal conductivity 1,7 W/(k*m) in-plane ISO 22007-4:2008
    Thermal conductivity 0,5 W/(k*m) through-plane ISO 22007-4:2008
  • product-technical-detail-collapse-item-2-lvl-1
    Electrical properties Value Unit Parameter Norm
    surface resistivity 1012 Ω DIN EN 61340-2-3
    volume resistivity 1011 Ω*m DIN EN 61340-2-3
    Dielectric loss factor 0,002 test frequency of 1 GHz -
    Dielectric constant 3,6 test frequency of 1 GHz -
    Resistance to tracking (CTI) 225 V DIN EN 60112
  • product-technical-detail-collapse-item-3-lvl-1
    Other properties Value Unit Parameter Norm
    Molding shrinkage 0,52 % longitudinal DIN EN ISO 294-4
    Molding shrinkage 0,56 % transverse DIN EN ISO 294-4
    Water absorption 0,1 % 23 °C / 50 % relative humidity up to saturation DIN EN ISO 62
    Flammability (UL94) V0 - at 0,8 mm DIN IEC 60695-11-10;
  • product-technical-detail-collapse-item-4-lvl-1
    Processing parameter Value Unit Parameter Norm
    processing temperatures 360 - 410 C -
    Mould temperature 170 - 210 C -
  • product-technical-detail-collapse-item-5-lvl-1
    Predrying Value Unit Parameter Norm
    Permissible residual moisture content 0,02 % -
    Drying temperature 150 - 160 C -
    Drying time 2 - 4 h -