TECASINT 5501 ESD light-brown
Polyimide with defined electrostatic dissipative properties
TECASINT 5501 ESD light-brown is an electrically modified polyimide based on the further development of TECASINT 5111. By modifying it with special additives, the PI plastic has a static dissipative effect and thus achieves a surface resistance of 106-108 ohm. The ESD material is therefore ideally suited for applications where electrostatic dissipation is to be ensured.
Like all polyimide resins, TECASINT 5501 ESD light-brown is highly resistant to thermal and mechanical stress. The glass transition temperature is 329 °C and the short-term service temperature is 300 °C. In addition, the PI material is characterised by its high creep resistance.
The PI Polyimide also offers a very low thermal expansion of 2.6 10-5 K-1, a high surface hardness and very good stiffness values. This makes TECASINT 5501 ESD light-brown suitable for applications in the semiconductor industry, electronics industry, cryogenics and also in mechanical engineering or in nuclear and vacuum technology. Furthermore, PI plastic is also resistant to high-energy radiation.
TECASINT 5501 ESD light-brown is produced in the shape of polyimide sheets.
Like all polyimide resins, TECASINT 5501 ESD light-brown is highly resistant to thermal and mechanical stress. The glass transition temperature is 329 °C and the short-term service temperature is 300 °C. In addition, the PI material is characterised by its high creep resistance.
The PI Polyimide also offers a very low thermal expansion of 2.6 10-5 K-1, a high surface hardness and very good stiffness values. This makes TECASINT 5501 ESD light-brown suitable for applications in the semiconductor industry, electronics industry, cryogenics and also in mechanical engineering or in nuclear and vacuum technology. Furthermore, PI plastic is also resistant to high-energy radiation.
TECASINT 5501 ESD light-brown is produced in the shape of polyimide sheets.