Ensinger is part of the 3D-MID network and a cooperation partner of LPKF, the technology driver for laser direct structurable applications.
With our compounds TECACOMP LDS, conductive tracks can be integrated into housing structures, thus reducing the number of components. The thermal conductivity of the materials enables efficient thermal management.
The very good electrical performance leads to low signal losses with very fine conductive structures, especially in antenna applications. The temperature resistance enables soldering in the reflow soldering process.
Overall, leaner, more efficient solutions can be realised.
