TECACOMP PA66 GF35 CF10 HI 1014744
Liquid crystal compound for filigree components with laser direct structuring
This compound, based on a thermoplastic liquid crystal polymer (LCP), has a low viscosity in the melt and enables the production of filigree components with high stiffness and low wall thickness. Additives optimise the coefficient of thermal expansion toward copper and increase thermal conductivity. The mechanical and thermal properties become significantly more isotropic through the addition of mineral fillers.
TECACOMP LCP LDS black 1049426 is reflow solderable and offers good metallizability and adhesion of the conductor tracks. With laser direct structuring (LDS), the smallest conductor path distances (fine pitch), high edge sharpness as well as through-hole plating (via) with a very small aspect ratio is possible. The compound can be used permanently up to 200 °C, and even up to 260 °C for short periods.
The very low water absorption of the plastic compound ensures high dimensional and thermal stability. It also impresses with its excellent electrical insulating properties and very good chemical resistance as well as inherent flame resistance. Applications include sensors, 3D antennas in smartphones or radar systems, AVT components, safety elements or LED components.
LDS components are mainly used in automotive and mechanical engineering and in electrical and lighting engineering. Ensinger supports customers early on in the project planning phase and, as a member of 3D MID, is involved in industry-related research projects. Moldflow data and sample plates (80 x 80 x 3 mm) for laser and metallization tests as well as tensile test bars are available for TECACOMP LCP LDS.