TECASINT 5511 SD light-brown

Polyimide with defined electrostatic dissipation

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TECASINT 5511 SD light-brown is a polyimide with modified electrical properties based on the unfilled TECASINT 5111 natural. 
The modification results in a surface resistivity in the range of 1009 Ohm to 1011 Ohm.

With this variant, we are adding another SD material to our portfolio alongside TECASINT 5501 ESD light-brown. The thermal properties of the two SD plastics are identical. 
TECASINT 5511 is particularly suitable for electrostatic dissipative applications where a slow dissipation rate or a higher surface resistance is required under demanding operating conditions.

Typical applications are workpiece carriers and adapter components for sensitive components in the semiconductor and electronics sector.

TECASINT 5511 SD light-brown is offered as a semi-finished product in the form of plates.

Facts

Chemical designation
PI (Polyimide)
Color
brown
Density
1.65 g/cm3

Main Features

  • electrically static dissipative
  • high thermal and mechanical capacity
  • low thermal expansion
  • high creep resistance
  • resistance against high energy radiation

Target industries

electronics
semiconductor technology
cryogenic engineering
electrical engineering
mechanical engineering
nuclear and vacuum technology

Downloads

Datasheet (PDF)

Technical details

  • product-technical-detail-collapse-item-0-lvl-1
    Mechanical properties Value Unit Condition Test Method
    Shore hardness 92 Shore D, 23°C DIN EN ISO 868
    Tensile strength 97 MPa 50 mm/min, 23°C DIN EN ISO 527-1
    Modulus of elasticity
    (tensile test)    		 5600 MPa 1 mm/min, 23°C DIN EN ISO 527-1
    Flexural strength 128 MPa 10 mm/min,23°C DIN EN ISO 178
    Compression strength 254 MPa 10 mm/min,23°C EN ISO 604
    Compressive strain at break 21,4 % 10 mm/min,23°C EN ISO 604
    Compression modulus 5890 MPa 1 mm/min, 23°C EN ISO 604
    Elongation at break (tensile test) 2,1 % 50 mm/min, 23°C DIN EN ISO 527-1
    Modulus of elasticity
    (flexural test)    		 5588 MPa 2 mm/min,23°C DIN EN ISO 178
    Elongation at break (flexural test) 2,3 % 10 mm/min,23°C DIN EN ISO 178
  • product-technical-detail-collapse-item-1-lvl-1
    Thermal properties Value Unit Condition Test Method
    Service temperature 300 C short-term -
    Glass transition temperature 329 C DIN EN ISO 11357
    Thermal conductivity 0,32 W/(k*m) 40°C DIN EN 821
    Specific heat 1,01 J/(g*K) DIN EN 821
    Service temperature - 20 C lower operating temperature -
    Thermal expansion (CLTE) 32 106*K-1 23-100°C DIN EN ISO 11359-1;2
    Thermal expansion (CLTE) 35 106*K-1 100-150°C DIN EN ISO 11359-1;2
    Service temperature 250 C long-term -
    Thermal expansion (CLTE) 35 106*K-1 50-200°C DIN EN ISO 11359-1;2
  • product-technical-detail-collapse-item-2-lvl-1
    Electrical properties Value Unit Condition Test Method
    surface resistivity 1010 - 1012 Ω/square 23°C ANSI ESD STM 11.11
    volume resistivity 1010 - 1012 Ω*cm 23°C ANSI ESD STM 11.12
    surface resistance 1009 - 1011 Ω 23°C ANSI ESD STM 11.11
    volume resistance 1009 - 1011 Ω 23°C ANSI ESD STM 11.12
  • product-technical-detail-collapse-item-3-lvl-1
    Other properties Value Unit Condition Test Method
    Flammability (UL94) V0 - corresponding to DIN IEC 60695-11-10;
    HZ-Catalogue yes - -
    HZ Technical guidelines yes lbs/in^2 -
    HZ Semicon brochure yes - -
    Water absorption 0.16 - 0.33 % 24h / 96h (23°C) DIN EN ISO 62
    Water absorption 0.60 % 24 h in water, 23°C DIN EN ISO 62
    Water absorption 1.55 % 24 h in water, 80°C DIN EN ISO 62

Stock program