TECASINT 4111 natural

unfilled polyimide

Compared with the other TECASINT materials the TECASINT 4100 series exhibits extremely high thermal stability, extremely low moisture absorption and high mechanical rigidity. This is accompanied by a very high oxidative stability and increased resistance to chemicals. TECASINT 4111 natural has a very high thermal stability (HDT/A=470 °C). Rigidity and modulus are significantly increased in relation to conventional polyimides in a temperature range up to 400 °C. This polyimide material also provides high thermal and electrical insulation and offers high purity with low outgassing in accordance with ESA regulation ECSS-Q-70-02.

TECASINT 4111 natural is included in Ensinger's semiconductor grade portfolio, that is produced with stringent contamination controls, and offering copy-exact compliance. Thus, Ensinger ensures the highest level of cleanliness and quality performance consistency of this unique property profile. TECASINT 4111 natural is often used in IC test sockets and electronic fixtures due to its excellent dimensional stability and micro machinability of tight tolerances.

The high level of stiffness with flexural modulus up to 6100 MPa and elongation down to 1.7 % achieved without reinforcing fillers allows for optimum bending resistance, minimum burr formation, and highest machining accuracy. Offering the lowest level of water absorption among different polyimide grades and very low CLTE compared to industry standard test socket materials, TECASINT 4111 natural can maintain high levels of dimensional stability during machining and after prolonged use. This PI plastic is also often used in semiconductor manufacturing equipment parts such as in plasma etching vacuum chambers due to its very low level of outgassing, superior plasma resistance, and temperature resistance.

As with all Ensinger semiconductor grade materials, we can confirm that TECASINT 4111 natural meets the limitations imposed by RoHS Directive 2011/65/EU Restriction of Hazardous Substances in electrical equipment, and can also provide further conformity declarations on request.


Facts

Chemical designation
PI (Polyimide)
Color
yellow
Density
1.47 g/cm3

Main Features

  • very high thermal and oxidative resistance
  • very low water absorption
  • low thermal expansion
  • high thermal and mechanical capacity
  • low outgassing
  • good chemical resistance
  • high creep resistance
  • sensitive to hydrolysis in higher thermal range

Target industries

Downloads

Technical details

products_technical_additionalnote_

  • product-technical-detail-collapse-item-0-lvl-1
    Mechanical properties Value Unit Condition Test Method
    Notched impact strength (Charpy) 1.1 kJ/m2 max 7.5 J DIN EN ISO 179-1
    Impact strength (Charpy) 20 kJ/m2 max 7.5 J DIN EN ISO 179-1
    Shore hardness 90 Shore D DIN EN ISO 868
    Tensile strength 89 MPa 0.40 inch/min ASTM D 638
    Modulus of elasticity
    (tensile test)
    6840 MPa 0.04 inch/min ASTM D 638
    Flexural strength 145 MPa 0.05 inch/min ASTM D 790
    Ball indentation hardness 345 MPa ISO 2039-1
    Elongation at break (tensile test) 1.5 % 0.40 inch/min ASTM D 638
    Modulus of elasticity
    (flexural test)
    6637 MPa 0.05 inch/min ASTM D 790
    Compression modulus 6712 MPa 0.05 inch/min ASTM D 695
    Elongation at break (flexural test) 2.2 % 0.05 inch/min ASTM D 790
    Compression strength 227 MPa 0.05 inch/min, 10% strain ASTM D 695
  • product-technical-detail-collapse-item-1-lvl-1
    Thermal properties Value Unit Condition Test Method
    Glass transition temperature n.a. F DIN EN ISO 11357
    Heat distortion temperature 878 F 1.82 MPa ASTM D 648
    Thermal conductivity 0.52 W/(k*m) 104°F ASTM E1461
    Specific heat 1.24 J/(g*K) ASTM E1461
    Thermal expansion (CLTE) 47 - 69 106*K-1 392-572°F DIN 53 752
    Thermal expansion (CLTE) 36 - 52 106*K-1 122-392°F DIN 53 752
    Thermal expansion (CLTE) 65 - 99 106*K-1 572-752°F DIN 53 752
  • product-technical-detail-collapse-item-2-lvl-1
    Electrical properties Value Unit Condition Test Method
    surface resistivity 1016 73°F ASTM D 257
    volume resistivity 1016 Ω*cm 73°F ASTM D 257
    Dielectric loss factor 0.0013 1 MHz ASTM D 150
    Electric strength DC 22.7 kV*mm-1 73°F ASTM D 149
    Dielectric constant 3.7 1 MHz ASTM D 150
  • product-technical-detail-collapse-item-3-lvl-1
    Other properties Value Unit Condition Test Method
    Flammability (UL94) V0 - corresponding to DIN IEC 60695-11-10;
    HZ-Catalogue yes - -
    HZ Technical guidelines yes lbs/in^2 -
    HZ Semicon brochure yes - -
    Water absorption 0.01 - 0.02 % 24h / 96h (23°C) -
    HZ Aerospace Brochure yes - -
    Outgassing in high vacuum passed ECSS-Q-70-02
    Water absorption 0.08 % 24 h in water, 73°F DIN EN ISO 62
    Water absorption 0.3 % 24 h in water, 176°F DIN EN ISO 62
    Oxygen Index 53 % EN ISO 4589-2

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