TECASINT 5051 grey-green

With 30 % glass fibre

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Starting with the unfilled base polymer TECASINT 5111, TECASINT 5051 with 30 % glass fibre has been developed. This material is characterised by reduced thermal elongation, reduced moisture absorption and high wear strength during chip test applications in the semiconductor industry. It has good electrical insulation properties and surface hardness, and also high rigidity. The glass transition temperature is 330 °C, while the maximum service temperature may be – for a short time – up to 300 °C.

Facts

Color
dark brown
Density
1.56 g/cm3

Main Features

  • high thermal and mechanical capacity
  • very good electrical insulation
  • good wear properties
  • low thermal expansion
  • resistance against high energy radiation
  • high creep resistance
  • good chemical resistance
  • sensitive to hydrolysis in higher thermal range

Target industries

semiconductor technology
electronics
mechanical engineering
cryogenic engineering

Downloads

Datasheet (PDF)

Technical details

  • product-technical-detail-collapse-item-0-lvl-1
    Mechanical properties Value Unit Condition Test Method
    Compressive strain at break 20 % 10 mm/min EN ISO 604
    Compression strength 260 MPa 10 mm/min EN ISO 604
    Flexural strength 162 MPa 10 mm/min DIN EN ISO 178
    Modulus of elasticity
    (tensile test)    		 6500 MPa 1 mm/min DIN EN ISO 527-1
    Tensile strength 110 MPa 50 mm/min DIN EN ISO 527-1
    Shore hardness 92 Shore D DIN EN ISO 868
    Impact strength (Charpy) 20 kJ/m2 max 7.5 J DIN EN ISO 179-1
    Compression modulus 3000 MPa 1 mm/min EN ISO 604
    Modulus of elasticity
    (flexural test)    		 6600 MPa 2 mm/min DIN EN ISO 178
    Elongation at break (tensile test) 2.2 % 50 mm/min DIN EN ISO 527-1
    Elongation at break (flexural test) 2.6 % 10 mm/min DIN EN ISO 178
  • product-technical-detail-collapse-item-1-lvl-1
    Thermal properties Value Unit Condition Test Method
    Specific heat 1.04 J/(g*K) DIN EN 821
    Thermal conductivity 0.3 W/(k*m) 40°C DIN EN 821
    Thermal expansion (CLTE) 2.8 - - 10-5*1/K 23-100°C DIN EN ISO 11359-1;2
    Glass transition temperature 330 C -
    Heat distortion temperature 344 C 1,8 MPa DIN 53 461
    Service temperature 300 C short-term -
    Thermal expansion (CLTE) 2.8 - - 10-5*1/K 100-150°C DIN EN ISO 11359-1;2
    Thermal expansion (CLTE) 2.8 - - 10-5*1/K 50-200°C DIN EN ISO 11359-1;2
  • product-technical-detail-collapse-item-2-lvl-1
    Electrical properties Value Unit Condition Test Method
    surface resistivity 1014 Ω 23°C DIN EN 61340-2-3
    Electric strength DC 24 kV*mm-1 ISO 60243-1
    volume resistivity > 1014 Ω*cm 23°C DIN EN 61340-2-3
    Dielectric loss factor 3.2*10-2 50 Hz DIN 53483-1
    Dielectric loss factor 2.2*10-3 1 kHz DIN 53483-1
    Dielectric loss factor 1.1*10-2 1 MHz DIN 53483-1
    Dielectric constant 3.0 50 Hz DIN 53483-1
    Dielectric constant 2.9 1 kHz DIN 53483-1
    Dielectric constant 2.9 1 MHz DIN 53483-1
  • product-technical-detail-collapse-item-3-lvl-1
    Other properties Value Unit Condition Test Method
    Water absorption 0.48 % 24h (23°C) DIN EN ISO 62
    HZ-Catalogue yes - -
    HZ Technical guidelines yes lbs/in^2 -
    HZ Semicon brochure yes - -
    Flammability (UL94) V0 - corresponding to DIN IEC 60695-11-10;
    Water absorption 0.48 % 24 h in water, 23°C DIN EN ISO 62
    Water absorption 1.66 % 24 h in water, 80°C DIN EN ISO 62

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