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TECAPEEK SX natural

PEEK PLASTIC UNFILLED FOR SEMICONDUCTOR INDUSTRY

TECAPEEK SX natural is an unfilled PEEK plastic material (polyetheretherketone) based on Victrex® PEEK 450, which is processed into sheets, rods and tubes. It meets the requirements of semiconductor copy exactly (also known as copy exact or CE) but is also feasible for many other industries with similar requirements. In addition, more stringent quality controls and measures enable improved internal stress and dimensional stability compared to standard industrial PEEK. As a result, the most demanding machined high-precision parts with the tightest tolerances can be readily realized for semiconductor manufacturing equipment. 

The peek material properties, such as excellent wear resistance and very good mechanical properties, even under thermal stress, also apply to TECAPEEK SX natural. Excellent chemical resistance, the high operating peek temperature range (up to 260 °C) complete the peek properties and make TECAPEEK SX natural an almost universally applicable material for highly stressed parts. However, the low ionic impurities that characterize TECAPEEK natural also apply to TECAPEEK SX natural.

With more than 400 different dimensions for TECAPEEK SX available, Ensinger offers the best PEEK plastic size diversity for the semiconductor industries demand.
In this way, machine shops can choose the closest size and save material waste and costs, thus enabling overall part cost reductions. Lot sizes range from just one single piece for prototyping projects, to large industrial size lots. More than 20 different sizes are always available on stock ensuring that even large quantities are always delivered in the shortest possible time or 'just-in-time'. This, together with our highly efficient stock management system, enables highest level of supply security.

As with all Ensinger semiconductor grade materials, we can confirm that TECAPEEK SX natural meets the limitations imposed by RoHS Directive 2011/65/EU Restriction of Hazardous Substances in electrical equipment, and can also provide further conformity declarations on request.

Specifically for CMP retaining rings, Ensinger offers an alternative unfilled PEEK grade: TECAPEEK CMP natural. This PEEK CMP grade offers a special property profile that enables a reduction in wafer defects when used as a CMP retaining ring.

 

Compliances

Facts

Chemical designation
PEEK (Polyetheretherketone)
Colour
beige
Density
1.31 g/cm3

Main Features

  • good heat deflection temperature
  • good machinability
  • inherent flame retardant
  • resistance against high energy radiation
  • good slide and wear properties
  • very good chemical resistance
  • high creep resistance
  • hydrolysis and superheated steam resistant

Target industries

Technical details


  • product-technical-detail-collapse-item-0-lvl-1
    Mechanical properties Value Unit Parameter Norm
    Modulus of elasticity
    (tensile test)
    4200 MPa 1mm/min DIN EN ISO 527-2
    Tensile strength 116 MPa 50mm/min DIN EN ISO 527-2
    Tensile strength at yield 116 MPa 50mm/min DIN EN ISO 527-2
    Elongation at yield (tensile test) 5 % 50mm/min DIN EN ISO 527-2
    Elongation at break (tensile test) 15 % 50mm/min DIN EN ISO 527-2
    Flexural strength 175 MPa 2mm/min, 10 N DIN EN ISO 178
    Modulus of elasticity
    (flexural test)
    4200 MPa 2mm/min, 10 N DIN EN ISO 178
    Compression modulus 3400 MPa 5mm/min, 10 N EN ISO 604
    Compression strength 23 / 43 / 102 MPa 1% / 2% / 5% EN ISO 604
    Impact strength (Charpy) n.b. kJ/m2 max. 7,5J DIN EN ISO 179-1eU
    Notched impact strength (Charpy) 4 kJ/m2 max. 7,5J DIN EN ISO 179-1eA
    Shore hardness 89 D DIN EN ISO 868
  • product-technical-detail-collapse-item-1-lvl-1
    Thermal properties Value Unit Parameter Norm
    Glass transition temperature 150 C DIN EN ISO 11357
    Melting temperature 341 C DIN EN ISO 11357
    Heat distortion temperature 162 C HDT, Method A ISO-R 75 Method A
    Thermal conductivity 0.27 W/(k*m) ISO 22007-4:2008
    Specific heat 1.1 J/(g*K) ISO 22007-4:2008
    Service temperature 300 C short term NN
    Service temperature 260 C long term NN
    Thermal expansion (CLTE) 5 10-5*1/K 23-60°C, long. DIN EN ISO 11359-1;2
    Thermal expansion (CLTE) 5 10-5*1/K 23-100°C, long. DIN EN ISO 11359-1;2
    Thermal expansion (CLTE) 7 10-5*1/K 100-150°C, long. DIN EN ISO 11359-1;2
  • product-technical-detail-collapse-item-2-lvl-1
    Electrical properties Value Unit Parameter Norm
    surface resistivity 1015 Silver electrode, 23°C, 12% r.h. -
    volume resistivity 1015 Ω*cm Silver electrode, 23°C, 12% r.h. -
    Dielectric strength 73 kV/mm 23°C, 50% r.h. ISO 60243-1
    Resistance to tracking (CTI) 125 V Platin electrode, 23°C, 50% r.h., solvent A DIN EN 60112
  • product-technical-detail-collapse-item-3-lvl-1
    Other properties Value Unit Parameter Norm
    Resistance to hot water/ bases + - -
    Flammability (UL94) V0 - listed (value at 1.5mm) DIN IEC 60695-11-10;
    Resistance to weathering - - -
    Water absorption 0.02 - 0.03 % 24h / 96h (23°C) DIN EN ISO 62
  • product-technical-detail-collapse-item-4-lvl-1
    Relative costs Value Unit Parameter Norm
    Relative costs EU from € to €€€€€€ €€€€€

Stock program