TECASINT 2011 natural

unfilled polyimide

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TECASINT 2011 is one of the unfilled natural grades. It has a very high modulus of elasticity, high rigidity and hardness. Compared with TECASINT 1011 it has significantly reduced moisture absorption, higher toughness and better machining properties. Within the TECASINT 2000 series the material has the maximum strength and elongation, together with a high modulus of elasticity and minimal thermal and electrical conductivity. TECASINT 2011 is highly pure with low outgassing in accordance with ESA regulation ECSS-Q-70-02.

Facts

Chemical designation
PI (Polyimide)
Color
brown
Density
1.38 g/cm3

Main Features

  • very good thermal stability
  • high thermal and mechanical capacity
  • low outgassing
  • very good electrical insulation
  • resistance against high energy radiation
  • good chemical resistance
  • high creep resistance
  • sensitive to hydrolysis in higher thermal range

Target industries

mechanical engineering
precision engineering
aircraft and aerospace technology
cryogenic engineering
electronics
electrical engineering
medical technology
semiconductor technology
vacuum technology

Downloads

Datasheet (PDF)

Technical details

products_technical_additionalnote_
  • product-technical-detail-collapse-item-0-lvl-1
    Mechanical properties Value Unit Condition Test Method
    Flexural strength 193 MPa 0.54 inch/min ASTM D 790
    Modulus of elasticity
    (tensile test)    		 3794 MPa 0.04 inch/min ASTM D 638
    Tensile strength 138 MPa 0.40 inch/min ASTM D 638
    Shore hardness 90 Shore D DIN EN ISO 868
    Notched impact strength (Charpy) 9.3 kJ/m2 max 7.5 J DIN EN ISO 179-1
    Impact strength (Charpy) 87.9 kJ/m2 max 7.5 J DIN EN ISO 179-1
    Ball indentation hardness 260 MPa ISO 2039-1
    Compression modulus 3781 MPa 0.05 inch/min ASTM D 695
    Modulus of elasticity
    (flexural test)    		 3776 MPa 0.54 inch/min ASTM D 790
    Elongation at break (tensile test) 8.9 % 0.40 inch/min ASTM D 638
    Modulus of elasticity
    (flexural test)    		 2300 MPa 10 mm/min, 250°C DIN EN ISO 178
    Compression strength 192 MPa 0.05 inch/min, 10% strain ASTM D 695
    Elongation at break (flexural test) % 0.54 inch/min DIN EN ISO 178
    Modulus of elasticity
    (flexural test)    		 2150 MPa 10 mm/min, 300°C DIN EN ISO 178
  • product-technical-detail-collapse-item-1-lvl-1
    Thermal properties Value Unit Condition Test Method
    Thermal conductivity 0.22 W/(k*m) 104°F ISO 8302
    Specific heat 0.925 J/(g*K) -
    Heat distortion temperature 606 F 1.80 MPa DIN 53 461
    Glass transition temperature 666 F -
    Thermal expansion (CLTE) 4 10-5*1/K 23-100°C, long. DIN EN ISO 11359-1;2
    Service temperature 290 C long-term -
    Thermal expansion (CLTE) 5 10-5*1/K 100-150°C, long. DIN EN ISO 11359-1;2
    Thermal expansion (CLTE) 44 - 43 106*K-1 122-392°F DIN 53 752
    Thermal expansion (CLTE) 51 106*K-1 392-572°F DIN 53 752
  • product-technical-detail-collapse-item-2-lvl-1
    Electrical properties Value Unit Condition Test Method
    volume resistivity 1015 Ω*cm 73°F DIN IEC 60093
    surface resistivity 1015 Ω 73°F DIN IEC 60093
    Electric strength DC 34.3 kV*mm-1 73°F ISO 60243-1
    Dielectric constant 3.5 100 Hz DIN VDE 0303
    Dielectric constant 3.5 1 kHz DIN VDE 0303
    Dielectric constant 3.4 10 kHz DIN VDE 0303
    Dielectric constant 3.4 100 kHz DIN VDE 0303
  • product-technical-detail-collapse-item-3-lvl-1
    Other properties Value Unit Condition Test Method
    HZ Aerospace Brochure no - -
    HZ Semicon brochure yes - -
    Water absorption 0.14 - 0.30 % 24h / 96h (23°C) DIN EN ISO 62
    HZ Technical guidelines yes lbs/in^2 -
    HZ-Catalogue yes - -
    Flammability (UL94) V0 - corresponding to DIN IEC 60695-11-10;
    Outgassing in high vacuum passed ECSS-Q-70-02
    Oxygen Index 51 EN ISO 4589-2
    Water absorption 0.47 % 24 h in water, 73°F DIN EN ISO 62
    Water absorption 1.65 % 24 h in water, 176°F DIN EN ISO 62

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