More powerful, more intelligent, more complex and more independent - the market for microsystems or Micro Electro Mechanical Systems is constantly growing. Many innovations in products and industries, for example in the automotive, medical, communications or energy sectors, are highly dependant on Micro Electro Mechanical Systems (MEMS).
Where currently complex and costly manufacturing methods, elaborate machinery and time consuming back-end processes place high demands on microsystems manufacturers, we offer a completely new approach with Ensinger Microsystems.
With the production of complete microsystems on Ensinger's own high-performance plastic and specially developed injection moulding processes, we offer suitable solutions for your individual application. The entire microsystems value chain - from compound to finished component - can be covered in-house at Ensinger.
We combine many years of experience and innovative development processes under one roof: for high-quality materials, products and services.
The right LDS-compatible compound is essential for the production of microsystems. Find out more about the LDS-TECACOMP PEEK developed by Ensinger.
Our injection moulding experts provide a wide range of potential structuring options. Learn more about plastic injection moulding for microsystems.
With our innovative approach, we produce microsystems such as sensors or transformers in a much more efficient, cost- and time-saving way. Find out more about the MEMS technology and MEMS devices below.
Microsystems such as coils, sensors or capacitors are usually made using lithography, PVD coatings and electrodeposition. Most microsystems require various lithography steps for structuring, some of which require a clean room environment as well as UV light shielding. Thus, they often entail, among other things, high investment costs in the infrastructure of the manufacturing plant as well as very high operating costs.
With Ensinger Microsystems' new approach, it is possible to produce complete microsystems outside the cleanroom environment and with a significant reduction in back-end processes. This makes it possible to manufacture microtechnological systems with lower financial costs as well as technological expenditure with similar precision as conventionally manufactured microsystems.
Shortening of the process chain
Development without clean room environment
Significantly simplified assembly by using backside contacting with the LDS process known from MID technology (Mold Interconnect Device)
Avoidance of wire bonding
Lower vertical range of manufacture and significantly lower investment in machine technology
More than 50 years of experience not only shape our in-depth knowledge of high-performance plastics and manufacturing processes. We also understand the need to constantly adapt to changing market developments, customer requirements and the challenges of modern applications. Rethinking existing processes, developing them further and driving new approaches has therefore always been an integral part of what we do.
Benefit from:
Depending on your requirements, we can offer you the complete supply chain from compound to finished component.
Power supplies, power electronics or electromobility.
Magnetic field sensors, such as AMR or GMR sensors in ABS systems of motor vehicles.
Rotary encoders or length scales in lifts, machine tools etc.
Strain gauges, pressure or temperature sensors.
Optical fibres or diffraction gratings on LDS-based components, e.g. in CO2 sensors.
