High-performance plastic solutions for semiconductor and electronics manufacturing

Many of the components in semiconductor and electronics manufacturing and testing equipment require thermally resistant materials. Components in elevated temperature environments must maintain high mechanical properties and dimensional stability, while keeping outgassing, leaching, and particle generation to a minimum level. Ensinger's high temperature resistant plastics can be used at service temperatures of up to 400 °C depending on the operating conditions. High performance plastics are increasingly replacing ceramics and quartz in high temperature applications due to lower risks of breakage, easier machinability, and better cost performance. Please contact us for material selection advice and further information about solutions for improving part lifetime and costs in semiconductor and electronics manufacturing tools and testing equipment. 

Even the smallest trace amounts of foreign molecules, in particular metals, can cause severe process degradation and compromise yield. Especially in advanced processes with reduced nodes, using ultraclean materials for equipment components is key for minimizing airborne molecular contamination (AMC) and particle contamination from material outgassing, leaching, and particle shedding.  
Ensinger's semiconductor material solutions are based on selected high purity polymers with a proven track record in critical semiconductor manufacturing equipment components with wafer contact. Moreover, the entire value chain from raw material inspection, compounding, molding, and further processing takes place under special conditions and specifications, that are designed to minimise the risks of impurities. Please contact us for material selection advice and further information about solutions for protecting semiconductor tool environments and processes from AMC and particle contamination.

Test in accordance with ICP-MS, concentration levels stated in ppm; (n.t.= not tested)

Various harsh chemicals are used to process and clean the wafers. Consequently, wet process tool components need to provide adequate chemical resistance to ensure part performance, maximize component life and minimize risks for contaminations. Erosion of the part surface can destroy its net shape and contaminate the substrate with particles. Moreover, chemical degradation compromises mechanical properties and can result in critical part failures.  
Ensinger offers a wide range of plastics with high chemical resistance, suitable for almost all wafer processing environments. As a general guide, the following table provides an indication of resistance to common chemicals used in wet process tools, under room temperature and without mechanical load. Chemical resistance of plastic is highly dependent on the temperature and operating conditions. Please contact us for material selection advice and further information about chemical resistance and solutions for enhancing part lifetime in wet process tools.   

Chemical resistance at room temperature

Comment: + = good, (+) = limited; - = unstable

Electrostatic discharge (ESD) management is key for semiconductor and electronics manufacturing equipment as particle attraction from electric charges or integrated circuit destruction from discharges can critically affect yield. Ensinger's extensive portfolio of electrically modified plastics has a proven track record in highly ESD sensitive semiconductor and electronics manufacturing processes, such as in wafer mobility components, chip transportation trays, IC test sockets, and electronics fixtures. The ELS series offers conductive plastics with a surface resistivity of 10² – 10⁴ Ω/sq, enabling the materials to quickly bleed away electric charge. The ESD series offers dissipative plastics with a surface resistivity of 10⁶ – 10⁹ Ω/sq, enabling a slower rate of decay of static charge in a controlled manner. The SD series offers anti-static plastics with a surface resistivity of 10⁹ – 10¹², providing the minimum current decay rate among the electrically modified plastics. In addition to the different conductivity levels, a broad range of polymers with different physical and thermal properties enable customers to find the best matching material to the applications needs. Please contact us for material selection advice and further information about our ESD management solutions. 

In semiconductor manufacturing processes such as vapor deposition, dry etching, or ion implantation, equipment components are exposed to highly aggressive and corrosive plasma under vacuum conditions. Some plasma processes operate with temperatures above 250 °C, requiring equipment components to provide high thermal stability. Ensinger's semiconductor grade polyimide TECASINT 4111 natural has been developed to offer superior plasma and temperature resistance compared to industry standard PI and other high performance plastics. Lower weight loss and etching speed at elevated temperatures enable longer part service life, resulting in reduced replacement shutdowns. Moreover, reduced material contamination enable significantly improved process yield. Please contact us for material selection advice and further information about material solutions for enhancing tool uptime and yield.

Etching rate

Weight loss

Many components in semiconductor and electronics manufacturing equipment require fine features with tight design and machining tolerances. Through optimization of the manufacturing process, Ensinger's semiconductor grade materials provide low internal stress levels, enabling superior dimensional stability during machining and in operation. Moreover, our semiconductor grade materials are based on selected polymers that provide high levels of dimensional stability in terms of thermal expansion, water absorption, and mechanical stability.  
Some of the high end applications like IC test sockets and electronic inspection fixtures require machined parts with micro holes, in some cases smaller than 0,1 mm. As such applications require special material property profiles, Ensinger has developed a dedicated portfolio with enhanced micro machinability and dimensional stability. Please contact us for material selection advice and further information about material solutions for enhancing part accuracy and stability.

Many components in semiconductor and electronics manufacturing and testing equipment components are exposed to high sliding speeds and pressing forces. Choosing the right material is key in such applications as the material's wear performance directly impacts part lifetime, replacement cycles, and maintenance costs. Moreover, high abrasion and particle shedding can cause excessive wafer contamination and significantly decrease process yield. Ensinger's plastic solutions have a proven track record in components requiring high resistance to wear and tear while providing high levels of cleanliness. Please contact us for material selection advice, tribological data, and additional information about solutions for enhancing part lifetime.

Oxid slurry

For a company supplying globally to high-tech applications, only the highest level of product compliance is good enough. We continually invest in research and close cooperation with raw material supplier and test institutes to stay ahead of today's latest demands. Upon customer's request we can issue conformance declarations for a broad range of environmental standards, such as REACH, RoHS, and others. Please contact us for our latest product compliance information.